(Hong Kong)
Product Summary
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
| Image | Part No | Mfg | Description |  |
Pricing (USD) |
Quantity | ||||
|---|---|---|---|---|---|---|---|---|---|---|
 |
 IRKD91/12A |
|
DIODE STD REC 1200V 100A ADDAPAK |
Data Sheet |
Negotiable |
|
||||
| Image | Part No | Mfg | Description | |
Pricing (USD) |
Quantity | ||||
|
IRKD166/04PBF |
Vishay Semiconductors |
Rectifiers 400 Volt 165 Amp |
Data Sheet |
Negotiable |
|
||||
|
IRKD166/08PBF |
Vishay Semiconductors |
Rectifiers 800 Volt 165 Amp |
Data Sheet |
Negotiable |
|
||||
|
IRKD166/12PBF |
Vishay Semiconductors |
Rectifiers 1200 Volt 165 Amp |
Data Sheet |
Negotiable |
|
||||
|
IRKD166/14 |
|
DIODE STD REC 1400V 165A INTAPAK |
Data Sheet |
Negotiable |
|
||||
|
IRKD166/14PBF |
Vishay Semiconductors |
Rectifiers 1400 Volt 165 Amp |
Data Sheet |
Negotiable |
|
||||
|
IRKD166/16 |
|
DIODE STD REC 1600V 165A INTAPAK |
Data Sheet |
Negotiable |
|
||||
