Product Summary

The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.

Features

High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRKD91/12A
IRKD91/12A


DIODE STD REC 1200V 100A ADDAPAK

Data Sheet

Negotiable 
Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRKD166/04
IRKD166/04


DIODE STD REC 400V 165A INTAPAK

Data Sheet

Negotiable 
IRKD166/08
IRKD166/08


DIODE STD REC 800V 165A INTAPAK

Data Sheet

0-9: $29.45
IRKD166/08PBF
IRKD166/08PBF

Vishay Semiconductors

Rectifiers 800 Volt 165 Amp

Data Sheet

Negotiable 
IRKD166/12
IRKD166/12


DIODE STD REC 1200V 165A INTAPAK

Data Sheet

Negotiable 
IRKD166/14
IRKD166/14


DIODE STD REC 1400V 165A INTAPAK

Data Sheet

Negotiable 
IRKD166/16
IRKD166/16


DIODE STD REC 1600V 165A INTAPAK

Data Sheet

Negotiable