Product Summary

The TMS320C6416TBGLZA6 is a Fixed-Point Digital Signal Processor. The TMS320C6416TBGLZA6 is the highest-performance fixed-point DSP generation in the TMS320C6000TM DSP platform. The TMS320C6416TBGLZA6 is based on the second-generation high-performance, advanced VelociTITM very-long-instruction-word (VLIW) architecture (VelociTI.2TM) developed by Texas Instruments (TI), making these DSPs an excellent choice for multichannel and multifunction applications. The C64xTM is a code-compatible member of the C6000TM DSP platform.

Parametrics

TMS320C6416TBGLZA6 absolute maximum ratings: (1)Supply voltage ranges CVDD : -0.3 V to 1.8 V; (2)DVDD : -0.3 V to 4 V; (3)Input voltage ranges (except PCI), VI : -0.3 V to 4 V; (4)(PCI), VIP : -0.5 V to DVDD + 0.5 V; (5)Output voltage ranges (except PCI), VO : -0.3 V to 4 V; (6)(PCI), VOP : -0.5 V to DVDD + 0.5 V; (7)Operating case temperature ranges, TC (default) : 0℃ to 90℃; (8)(A version) [A-500 only] : 40℃ to 105℃; (9)Storage temperature range, Tstg : -65℃ to 150℃; (10)Package Temperature Cycling Temperature Range : -40℃ to 125℃; (11)Number of Cycles : 500.

Features

TMS320C6416TBGLZA6 features: (1)Endianess: Little Endian, Big Endian; (2)64-Bit External Memory Interface (EMIF)Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM SBSRAM, ZBT SRAM, and FIFO); (3)1024M-Byte Total Addressable External Memory Space; (4)Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels); (5)Management Data Input/Output (MDIO); (6)Host-Port Interface (HPI) [32-/16-Bit]; (7)32-Bit/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Specification 2.2; (8)Inter-Integrated Circuit (I2C) Bus; (9)Two Multichannel Buffered Serial Ports; (10)Three 32-Bit General-Purpose Timers; (11)Sixteen General-Purpose I/O (GPIO) Pins; (12)Flexible PLL Clock Generator; (13)IEEE-1149.1 (JTAG)Boundary-Scan-Compatible; (14)548-Pin Ball Grid Array (BGA) Package (GDK Suffix), 0.8-mm Ball Pitch; (15)548-Pin Ball Grid Array (BGA) Package (GNZ Suffix), 1.0-mm Ball Pitch; (16)0.13-μm/6-Level Cu Metal Process (CMOS); (17)3.3-V I/Os, 1.2-V Internal (-500); (18)3.3-V I/Os, 1.4-V Internal (A-500, -600).

Diagrams

TMS320C6416TBGLZA6 pin connection

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
TMS320C6416TBGLZA6
TMS320C6416TBGLZA6

Texas Instruments

Digital Signal Processors & Controllers (DSP, DSC) Fixed-Point DSP

Data Sheet

Negotiable 
Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
TMS3112
TMS3112

Other


Data Sheet

Negotiable 
TMS3121
TMS3121

Other


Data Sheet

Negotiable 
TMS320
TMS320

Other


Data Sheet

Negotiable 
TMS32010
TMS32010

Other


Data Sheet

Negotiable 
TMS320AV7110
TMS320AV7110

Other


Data Sheet

Negotiable 
TMS320BC51PQ100
TMS320BC51PQ100

Texas Instruments

Digital Signal Processors & Controllers (DSP, DSC) TMS320C51PQ - 132QFP - 100MHZ/BOOT CODE

Data Sheet

Negotiable