Product Summary
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and
are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction
efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash.
Their peripheral functions are the same.
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![]() R5F21266SNFP#V2 |
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![]() IC R8C/26 MCU FLASH 32LQFP |
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![]() R5F21102DFP#U0 |
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![]() IC R8C MCU FLASH 8K 32LQFP |
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![]() R5F21102FP#V0 |
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![]() IC R8C MCU FLASH 8K 32LQFP |
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![]() R5F21103DFP |
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![]() MCU 3/5V 12K I-TEMP 32-LQFP |
![]() Data Sheet |
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![]() R5F21103DFP#V0 |
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![]() IC R8C MCU FLASH 12K 32LQFP |
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![]() R5F21103FP#U0 |
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![]() IC R8C MCU FLASH 12K 32LQFP |
![]() Data Sheet |
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![]() R5F21104DFP#U0 |
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![]() IC R8C MCU FLASH 32LQFP |
![]() Data Sheet |
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