Product Summary

Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile
LPDRAM devices in a single MCP. These products target mobile applications with lowpower, high-performance, and minimal package-footprint design requirements. The
NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete
memory products portfolio.
The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces
(no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses.
The NAND Flash and Mobile LPDRAM devices have separate core power connections
and share a common ground (that is, VSSis tied together on the two devices).
The bus architecture of this device also supports separate NAND Flash and Mobile
LPDRAM functionality without concern for device interaction.