AT25256B-SSHL-T

AT25256B-SSHL-T, SPI Serial EEPROM, 7.0V, 5.0mA, 5 ms, SOIC

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Price:: US $0.10~0.20 / piece [Get Latest Price]

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PartNumber:: AT25256B-SSHL-T

Brand:: ATMEL Corporation - ATMEL | Pack: SOIC | D/C: 13+

Availability:: Supply Ability: 100000/Day Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2013-06-01

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Part Number:AT25256B-SSHL-T
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AT25256B-SSHL-T

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Product Summary

The AT25256B-SSHL-T is a SPI Serial EEPROM. The AT25256B-SSHL-T provides 131,072/262,144 bits of serial electrically-erasable programmable read only memory (EEPROM) organized as 16,384/32,768 words of 8 bits each. The AT25256B-SSHL-T is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The device is available in space saving 8-lead SOIC, 8-lead TSSOP, 8-ball VFBGA and 8-lead UDFN packages. In addition, the entire family is available in 1.8V (1.8V to 5.5V). The AT25256B-SSHL-T is enabled through the Chip Select pin (CS) and accessed via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK).

Parametrics

AT25256B-SSHL-T absolute maximum ratings: (1)Operating Temperature: –55℃ to +125℃; (2)Storage Temperature: –65℃ to + 150℃; (3)Voltage on Any Pin with Respect to Ground: –1.0 V +7.0V; (4)Maximum Operating Voltage: 6.25V; (5)DC Output Current: 5.0 mA.

Features

AT25256B-SSHL-T features: (1)Serial Peripheral Interface (SPI) Compatible; (2)Supports SPI Modes 0 (0,0) and 3 (1,1); (3)Data Sheet Describes Mode 0 Operation; (4)Low-voltage and Standard-voltage Operation: 1.8 (VCC = 1.8V to 5.5V); (5)20 MHz Clock Rate (5V); (6)64-byte Page Mode and Byte Write Operation; (7)Block Write Protection: Protect 1/4, 1/2, or Entire Array; (8)Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection; (9)Self-timed Write Cycle (5 ms Max); (10)High-reliability: Endurance: 1 Million Write Cycle Data Retention: >100 Years; (11)Green (Pb/Halide-free/RoHS Compliant) Packaging Options; (12)Die Sales: Wafer Form, Waffle Pack, and Bumped Die.